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4727
    發(fā)布時(shí)間: 2018-09-11 12:24    
4727

C-EP 4727-1R            Technical Data Sheet

ONE COMPONENT EPOXY SURFACE MOUNT ADHESIVE

單組分環(huán)氧樹脂貼片膠

 

PRODUCT DESCRIPTION 產(chǎn)品介紹

C-EP 4727-1R surface mount adhesive is formulated to bond electrical devices or other small parts to printed circuit boards before wave soldering by Stencil Print Method. It has following features. C-EP 4727-1R貼片膠用于模板印刷法的波峰焊之前將電子元器件或其它的小型部件粘接在印刷電路板上.它具有以下特性.

  • A range of dot height with single stencil thickness obtainable 可獲得單模板厚度的點(diǎn)高度排列

  • Excellent green/wet strength 極佳的未固化/濕強(qiáng)度

  • High speed printing 高速印刷

     

PROPERTIES OF UNCURED MATERIAL 固化前材料性能

Property

性能

Test Method

測試方法

C-EP 4727-1R

Color/Appearance 顏色/外觀

Visual

Viscous Red paste 粘稠紅色漿糊

Specific Gravity 密度, g/cc,

ASTM D-792

1.3

Viscosity 粘度, cone & Plate, Pa.s

ASTM D-2393

200-450 (25°C)

Yield strength 屈服強(qiáng)度, cone & Plate, Pa, 25°C

 

400-600

 

TYPICAL PROPERTIES OF CURED MATERIAL 固化后材料典型物理性能

Property

性能

Test Method  

測試方法

Value

數(shù)值       

Coefficient of thermal expansion 熱膨脹系數(shù), CTE

ASTM D696

85 E-06

Thermal conductivity 導(dǎo)熱率, w/m-k

ASTM C177

0.25

Glass transition temperature 玻璃化轉(zhuǎn)變溫度, Tg, °C

ASTM D4065

135

Lap shear strength, steel 搭接剪切強(qiáng)度, Mpa

 

20

Torque strength 扭轉(zhuǎn)強(qiáng)度, FR4 PCB, N.mm

 

55

Pull off strength 拉離強(qiáng)度, FR4 PCB, N

 

50

Volume resistivity 體電阻系數(shù), ohms-cm

ASTM D-257

5 E+15

Surface resistivity 表面電阻系數(shù), ohms

ASTM D-257

30 E+15

Dielectric constant 電介質(zhì)常數(shù)

ASTM D150

2.8(1 kHz), 2.7(10 kHz)

Hot solder dip @ 260°C 熱浸焊@ 260°C

 

Pass

Humidity 98%RH / 40°C, 1000 hours, strength retention

相對(duì)濕度98%/40°C1000小時(shí)后的強(qiáng)度保持

 

80%

 

DIRECTIONS FOR USE 使用方法

Typical curing condition 典型固化條件:      90 ~ 120 seconds at 150 oC 150 oC下保持90 ~ 120

Curing starts above 100 oC, with a DSC conversion of 90%, 2 min. at 125 oC, 10 min. at 100 oC 固化開始于100 oC以上, 125 oC保溫2分鐘, 100 oC保溫10分鐘, 熱轉(zhuǎn)換為90%.

 

CLEANING 清除
Uncured adhesive can be easily removed from printed circuit boards using isopropyl alcohol(IPA) or MEK. 未固化膠粘劑可被輕易從印刷電路板上用異丙醇或丁酮清除

 

STORAGE INFORMATION 保存方法

5 oC下密封干燥儲(chǔ)存, 保質(zhì)期為6個(gè)月