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C-EP4628            Technical Data Sheet Single component epoxy adhesive單組分環(huán)氧樹脂粘接劑

PRODUCT DESCRIPTION 產(chǎn)品介紹

C-EP 4628 is a one component, heat cure, reworkable CSP/BGA underfill. The material cures at low temperature.  The cured material shows excellent protection  for  a variety of mechanical stress, including shock, drop and vibration etc.

C-EP 4628是一種單組分，熱固化，可返修的CSP/BGA底部填充膠。該材料可低溫固化。在固化后該材料可對手提設(shè)備中的焊接部在承受沖擊、落下、震動等機械和熱應(yīng)力時提供優(yōu)異的保護.

PROPERTIES OF UNCURED MATERIAL 固化前材料性能

RECOMMENDED CURING CONDITIONS推薦固化條件

5 minutes @ 150 °C          150°C下5分鐘

10 minutes @ 130 °C        130°C下10分鐘

Note: the time required for cure depends on the rate of heating in all fast cure systems, Cure rates depend on the mass of material to be heated and intimate contact with the heat source. Conditions where a hot plate or heat sink is used are optimum for fastest cure. We recommend using the recommended curing conditions. 注:在所有的快速固化系統(tǒng)中，需要的固化時間取決于加熱速率。當使用熱板或散熱片的條件下能達到最佳的最快的固化效果。固化速度取決于材料的質(zhì)量與加熱熱源的接觸程度。我們建議使用推薦的固化條件。

TYPICAL PROPERTIES OF CURED MATERIAL 固化后材料典型物理性能

Material cured at  100°Cx60 minutes 材料在100°C下固化60分鐘

GENERAL INFORMATION一般資料

For safe handling information on this product, consult the Material Safety Data Sheet (MSDS). 有關(guān)本產(chǎn)品的安全注意事項，咨詢材料安全數(shù)據(jù)表（MSDS）。

Handling Information儲運注意事項

1. Refrigerated transport冷藏運輸

All shipping boxes are packed with cold gel packs to maintain temperature below 8 °C during transit. 所有的運輸箱里都填充滿冷凝膠包以保證在運輸過程中保持溫度低于8°C.

2. Temperature Equilibration溫度平衡

Under ambient conditions, a new packed product can be allowed to place at room temperature (22 ± 2 ° C) for 1 to 2 hours (the actual time required will vary with the package size / volume change). Do not release the lid of the container, the cap or cover ,syringe packs must be allowed to equilibrate in tip down orientation. Heat Must never be used as partial polymerization (curing) could occur. 室溫條件下，一個新包裝好的產(chǎn)品可以允許放置在室溫下（22±2℃），為1?2小時（實際所需的時間將隨封裝尺寸/體積的變化而變化）。不要松開容器的蓋子，帽或罩：注射器包必須讓尖向下的方向中平衡。絕不能用來加熱否則可能發(fā)生部分聚合（固化）.

Usage使用方法

Product into dispensing equipment. The various dispensing equipment are applicable, including: manual dispensing / timing pressure valve, the screw-type valve, linear piston pump, and the jet valve. Equipment selection should depend on the application requirements, equipment selection and process optimization suggestions, users should contact the Technical Service Center. 將產(chǎn)品放入點膠設(shè)備。各種不同的點膠設(shè)備都是適用的，其中包括：手工點膠/定時壓力閥，螺旋式閥門，線性活塞泵和射流閥。設(shè)備選型應(yīng)取決于應(yīng)用的需求 ，在設(shè)備選型和工藝優(yōu)化方面的建議，用戶應(yīng)聯(lián)系相關(guān)的技術(shù)服務(wù)中心.

1. To ensure that the air in the running of the equipment does not introduce products. 確?？諝?/span>在設(shè)備運行時不引入產(chǎn)品中

2. For best results, the substrate should be preheated  (typically to 40 °C for about 20 seconds) to allow fast capillary flow and facilitate leveling 為了獲得最佳結(jié)果,應(yīng)預(yù)熱基板（通常為40℃下進行約20秒）,以允許最快速的毛細流動和便于流平.

3. The product distribution at medium speed (2.5 to 12.7 mm / sec), to ensure that the needle tip of about 0.025 to 0.076 mm from substrate surface and from chip edge , which will ensure optimum flow conditions for the underfill. 以中等速度（2.5至12.7毫米/秒）配送產(chǎn)品,確保針尖約0.025到0.076毫米的基板表面和芯片邊緣,這將確保最佳的流動條件下的底部填充.

4. Dispensing mode is usually along the "I" on one side or along the "L" mode on both sides, focused on the corner. The dispensing program should start from the furthest away from the location of the center of the chip - which helps ensure void-free fill below the mold.. Each leg of the "L" or "I" pattern should not exceed 80 % of the length of each die edge being dispensed 點膠模式通常是沿"I"一側(cè)或沿"L"模式兩側(cè)，集中在角落里。點膠程序應(yīng)該從最遠的遠離芯片中心位置開始 - 這有助于確保無空隙的填充下面的模具。"L"或"I"的模式下，每個橋臂不應(yīng)該超過模具邊緣長度的80％.

For Rework返修說明

1. Removal of CSP from PCB 從PCB上去除CSP

Any molten solder instrument are suitable for removing the CSP in this step. When reach a sufficiently high temperature, touch the fillet of underfill around the CSP using a scraper to see if it is softened. to see whether it is being softened. If the fillet is sufficiently soft t, remove it. When bondline reaches temperature above melting point of solder, indicated by molten solder blowing out between CSP & PCB, . 任意能夠熔融焊料的儀器都是適合用于除去在此步驟中的CSP。當達到足夠高的溫度時，用刮刀觸摸周圍的底部填充料的圓角的CSP，看它是否被軟化。如果圓角足夠軟，取出圓角。當膠層達到焊料的熔點溫度以上，熔融焊料從CSP和PCB之間吹出來，用刮刀將CSP從PCB移除。
 2. Removing Underfill Residue移除底部填充膠殘留物

After removing the CSP, scrape away underfill and solder residues on the surface of the PCB using the Soldering Iron.  Typically recommendation of iron top temperature is 250 to 300 °C (setting temperature). Scraping of residue should be carefully executed to avoid damaging resist and pads on PCB. 除去CSP之后，用烙鐵刮去底部填充料和殘留在PCB表面的焊劑。通常，建議的鉻鐵最高溫度為250?300℃（設(shè)定溫度）。去除殘留物應(yīng)認真執(zhí)行，用墊片墊在PCB上以避免損壞。
3. Clean Up清理

With a clean, dry cotton swab moistened with an appropriate solvent wipe the surface. Repeat this step用干凈的干棉簽用沾適當?shù)娜軇?，擦拭表面。重?fù)此步驟。

Do Not return product to refrigerated storage; any surplus　product should be discarded產(chǎn)品不返回冷藏儲存有任何盈余的產(chǎn)品應(yīng)該丟棄

Storage儲存

Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling. 未開封的產(chǎn)品容器貯存于在干燥的地方。存儲的信息在產(chǎn)品外包裝的標簽上注明。

Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or greater than 8 °C can adversely affect product properties. 理想貯存條件：2°C至8°C。存儲低于2°C或高于8°C可能會影響產(chǎn)品性能

Material removed from containers may be contaminated during use. Do not return product to the original container.  If you need additional information, please contact your local Technical Service Center or Customer Service Representative. 取出的材料在使用過程中可能被污染。所以產(chǎn)品不要倒回原來的容器中。如果需要額外的信息，請聯(lián)系您當?shù)氐募夹g(shù)服務(wù)中心或客戶服務(wù)代表。

Note聲明

The data contained herein are for reference only, are reliable. zhbond Company can help users determine the best  appropriate use of this product, to determine the best appropriate production methods and mentioned herein preventive measures, we recommend each future users repeat testing should be carried out before using it and  using this test data as a guide . 本文中所含的數(shù)據(jù)僅供參考，都是可靠的。正邦公司可幫助用戶確定本產(chǎn)品的最適合用途，確定最適合的生產(chǎn)方法以及本文提到的相關(guān)預(yù)防措施等，我們建議每個未來的用戶使用前都要進行重復(fù)測試并使用此測試數(shù)據(jù)作為指導(dǎo)。

Notes:  it is the user’s responsibility to determine the suitability of the products and methods of use.