C-EP 4311 Technical Data Sheet

PRODUCT DESCRIPTION 產(chǎn)品介紹

C-EP 4311 is a heat curing adhesive which is used in field of needing chemical resistant, fast and low temperature heat curing. It can bond dissimilar engineering substrates. C-EP 4311是一種具有化學(xué)抵抗性，低溫快速固化膠黏劑。他可用于粘結(jié)多種不同的工程材料介質(zhì)。

MAJOR FEAURES主要優(yōu)點(diǎn)：

Resilient and flexible具有彈性和柔韌性
Non-conductive不導(dǎo)電
Sag resistant paste 觸變性
One component and not need mix單組份不需要混合
Excellent in standing up to humidity and chemical permeation 抗水汽及化學(xué)介質(zhì)侵蝕性能極佳
Fast cure at low temperature 低溫快速固化

PROPERTIES OF UNCURED MATERIAL 固化前材料性能

Property性能	C-EP 4311
Color/Appearance顏色/外觀	棕色
Viscosity粘度, (cP), 25℃	150,000
Specific gravity比重, g/cm³	1．15
Shelf life@-18℃,months, 儲(chǔ)存時(shí)間	3
Sag resistance抗流淌性, cm	2.5

TYPICAL PROPERTIES OF CURED MATERIAL 固化后材料典型物理性能

Property性能	Value數(shù)值
Hardness硬度, Shore D	77
Temperature range of use 工作溫度,℃	-25 to100
Adaptive substrates 適合工作的介質(zhì)	Polyimide, Polyphenylene oxide, Polybutylene terephthlate, Polysulfone, Silicon, Copper and Gold。PA, PPO,PB,PSF,Si,Cu,Au