C-EP 68 A/B Technical Data Sheet

PRODUCT DESCRIPTION 產(chǎn)品描述

C-EP 68 A/B is an epoxy adhesive for electric connection where room temperature cure is required. It has following advantages. C-EP 68 A/B是一款雙組分環(huán)氧體系的室溫固化導電膠。C-EP 68 A/B具有以下優(yōu)勢：

Electrically conductive 導電性
High thermal conductive 高導熱
Thixotropic 觸變性
Ease of use 易于使用
Good bond strength 粘結性好

PROPERTIES OF UNCURED MATERIAL 固化前材料性能

Properties

性能

Test Method

測試方法

Resin-A

環(huán)氧樹脂-A

Hardener-B

固化劑-B

Mixed-A/B

混合物-A/B

Color/Appearance

顏色/外觀

Visual

目測法

Silver

銀色

Silver

銀色

Silver

銀色

Specific Gravity, g/cm3比重

ASTM D-792

3.5

3.1

3.5

Viscosity @ 25°C, cps 粘度（25°C）

ASTM D-2393

Thixotropic

觸變膏體

Thixotropic

觸變膏體

Thixotropic

觸變膏體

TYPICAL CURED PROPERTIES 固化后屬性

Cured 7 days @ 25 oC (77oF)（固化七天@25 oC）

Property 性能	value 數(shù)值
Flexural strength 撓曲強度,psi	10200
Tensile lap shear strength,psi@ 25 oC	700
Thermal Conductivity 導熱率, W/M-K	7.2
Max. service temperature 最大工作溫度, oC	90
Min. service temperature 最大工作溫度, oC	-40
Volume resistivity 體積電阻率, ohms-cm	0.0006

MIX RATIO 混合比例

Resin/Hardener Ratio (by weight) 樹脂與固化劑重量比	100 / 100
Resin/Hardener Ratio (by volume) 樹脂與固化劑體積比	100 / 100
Pot Life (100 gram mass), 25°C, minutes 操作時間（100g）25°C，分鐘	60

CURING TIME TABLE 固化進度表

Temperature 溫度	Minimum Cure Time 最少固化時間
25 oC (77oF)	16-24 hours
65 oC (149oF)	3 hours
100 oC (212oF)	45 minutes

SHELF METHOD 保存方法

Store at 25 oC in a dry place. After each use, tightly reseal. 每次用完后，應密封保存于25oC的干燥地方。

SHELF LIFE儲藏壽命

Provided this material is stored under the recommended storage conditions in their original containers, it will remain in useable condition for half year from date of shipping. 采用原始包裝，保存于15 - 30 oC的干燥地方，保質期為半年（從發(fā)貨之日算起）。